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PAN1026A bluetooth basic data rate and low energy module product specification rev. 0.1 wireless modules ? ????
? PAN1026A bluetooth module product specification rev. 0.1 page 2 overview the pan1026 a is a class 2 bluetooth 4. 2 basic data rate and low energy module for easy implementation of bluetooth functionality in to various electronic devices. features ? bluetooth 4.2 basic data rate (br) and low energy (le) ? embedded spp profile ? embedded gatt profile ? high - level api commands ? bluetooth 4.2 (le) embedded gatt profile with high - level api commands, compatible with toshiba reference ble profiles ? operational temp erature range - 40 to +85 c ? operational voltage 2.7 v to 3.6 v +/ - 10 % ? power consumption tx: 46 ma ? dimensions 15.6 x 8.7 x 1.9 mm ? output power 4 dbm ? - 88 dbm sensitivity ? integrated high speed crystal oscillator (26 mhz ) new features ? increased (2.5 x) ble data transfer rates through extended mtu size (64 b ytes to 160 b ytes) ? more complex ble profiles possible through extended gatt functionality ? data base pool, number of services and characteristics, data flow control ? fast spp classic connection/disconnectio n times ? interlaced inquiry/page scan & extended inquiry response ? transmission (tx) power control ? improved per (peak - error - rate) for ble traffic ? integration of bt 4.2 secure connecting feature implementing ecdh technology bluetooth ? gap support for spp ? gap peripheral and broadcast support for le ? gatt s erver and c lient m ode support for le ? gap central and observer not supported for le interfaces ? uart, gpio (10 input/output pins), wake - up control pins block diagram chip antenna toshiba tc35661 eeprom 32 kbit uart gpios host wake up reset 32 khz input wake up vcc 3.3 v lpf PAN1026A bluetooth 4.2 module crystal 26 mhz
? PAN1026A bluetooth module product specification rev. 0.1 page 3 by purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. panasonic reserves the right to make changes as required at any t ime without notification. please consult the most recently issued product s pecification before initiating or completing a design. ? panasonic indus trial devices europe gmbh 201 7 . this specification sheet is copyrighted. reproduction of this document is pe rmissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. do not disclose it to a third party. all rights reserved. this product specification does not lodge the claim to be complete and free of mistakes. engineering samples (es) if engineering samples are delivered to the customer, these samples have the status engineering samples. this means that the design of this product is not yet concluded. engineering samples may be partially or fully functional, and they may differ from the published product specification. engineering samples are not qualified and they are not to be used for reliability testing or series production. disclaimer the c ustomer acknowledges that samples may deviate from the product specification and may bear defects due to their status of development and the lack of qualification mentioned above. panasonic rejects any liability or product warranty for engineering samples. in particular, panasonic disclaim s liability for damages caused by: the use of the engineering sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the c ustomer, deviation or lapse in function of the engineering sample, improper use of the engineering sa mple. panasonic industrial devices europe gmbh disclaims any liability for consequential and incidental damages. in case of any queries regarding the engineering samples, please contact your local sales partner or the rela ted product manager.
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PAN1026A bluetooth module product specification rev. 0.1 page 4 table of contents 1 about this document ................................ ................................ ................................ ......................... 5 1.1 purpose and audience ................................ ................................ ................................ .............. 5 1.2 revision history ................................ ................................ ................................ ......................... 5 1.3 use of symbols ................................ ................................ ................................ ......................... 5 1.4 related documents ................................ ................................ ................................ ................... 5 2 overview ................................ ................................ ................................ ................................ .............. 6 2.1 block diagram ................................ ................................ ................................ ........................... 7 2.2 pin configuration ................................ ................................ ................................ ....................... 8 2.3 uart interface ................................ ................................ ................................ ........................ 10 2.4 bluetooth features ................................ ................................ ................................ .................. 10 3 detailed description ................................ ................................ ................................ ......................... 11 3.1 dimensions ................................ ................................ ................................ .............................. 11 3.2 footprint ................................ ................................ ................................ ................................ .. 12 3.3 packaging ................................ ................................ ................................ ................................ 13 3.4 case marking ................................ ................................ ................................ .......................... 16 4 specification ................................ ................................ ................................ ................................ ..... 17 4.1 default test conditions ................................ ................................ ................................ ........... 17 4.2 absolute maximum ratings ................................ ................................ ................................ ..... 17 4.3 recommended operat ing conditions ................................ ................................ ...................... 18 4.4 current consumption ................................ ................................ ................................ ............... 18 4.5 bluetooth ................................ ................................ ................................ ................................ . 19 4.6 reliability tests ................................ ................................ ................................ ....................... 19 4.7 recommended soldering profile ................................ ................................ ............................. 20 5 cautions ................................ ................................ ................................ ................................ ............ 21 5.1 design notes ................................ ................................ ................................ ........................... 21 5.2 installation notes ................................ ................................ ................................ ..................... 21 5.3 usage condition notes ................................ ................................ ................................ ............ 22 5.4 storage notes ................................ ................................ ................................ .......................... 22 5.5 safety cautions ................................ ................................ ................................ ....................... 22 5.6 other cautions ................................ ................................ ................................ ........................ 23 5.7 life support policy ................................ ................................ ................................ ................... 23 6 regulatory and certificati on information ................................ ................................ ....................... 24 6.1 rohs and reach declaration ................................ ................................ ............................... 24 6.2 further regulatory information ................................ ................................ ................................ 24 7 appendix ................................ ................................ ................................ ................................ ........... 25 7.1 ordering information ................................ ................................ ................................ ................ 25 7.2 contact details ................................ ................................ ................................ ........................ 26
? PAN1026A bluetooth module 1 about this document product specification rev. 0.1 page 5 1 about this document 1.1 purpose and audience this product specification provides details on the functional, operational, and electrical characteristics of the panasonic PAN1026A module. it is intended for hardware design, application, and original equipment manufacturers (oem) engineers . the product is referred to as the pan 1026 a or the module within this document. 1.2 revision history revision date modifications/remarks 0.1 23 .03.2017 1st preliminary version. 1.3 use of symbols symbol description note indicates important information for the proper use of the product. non - observance can lead to errors. attention indicates important notes that, if not observed, can put the products functionality at risk. ? [chapter number] [chapter title] cross reference indicates crossreferences within the document. example: description of the symbols used in this document ? 1.3 use of symbols . 1.4 related documents please refer to the panasonic web site for related documents ? 7.2.2 product information .
? PAN1026A bluetooth module 2 overview product specification rev. 0.1 page 6 2 overview the pan1026 a is based on toshibas single - chip tc35661 bluetooth semiconductor device with an embedded toshiba bluetooth sig certified stack. the pan1026 a is a highly integrated dual mode bluetooth controller that delivers high - speed operation at ultra - low power consumption. an embedded spp (serial port profil e of bluetooth classic) and a gatt (generic attribute profile of bluetooth le) stack are integrated. the module significantly reduces external component count and power consumption in applications requiring support of bluetooth 4.2 standards. edr (enhanced data rate) or central mode are not supported. details about iap integration can be provided on request. the integrated eeprom has a panasonic mac address and it can be used to store l ink k eys. the module allows for serving both legacy bluetooth classic an d bluetooth low energy connections with rapid connection and disconnection, needed by a wide range of applications, all at a small form factor. compared to the pan1026, the PAN1026A has additional features for secure connections via bluetooth le and it is fully backwards compatible. next to increased low energy transfer speed, transmissio n power can also be controlled. the pan1026 a module is manufactured in a small 15.6 x 8.7 x 1.9 mm smd package with a shielded case and it is qualified according to the b lu etooth 2.1 and 4.2 standards. please refer to the panasonic website for related documents ? 7.2.2 product information . further information on the variants and versions ? 7.1 ordering information .
? PAN1026A bluetooth module 2 overview product specification rev. 0.1 page 7 2.1 block diagram total cap a citor value: 6.7 f +/ - 10 % total inductance: 2 nh +/ - 10 % total resistance: 220 k? +/ - 10 % chip antenna toshiba tc35661 eeprom 32 kbit uart gpios host wake up reset 32 khz input wake up vcc 3.3 v lpf PAN1026A bluetooth 4.2 module crystal 26 mhz
? PAN1026A bluetooth module 2 overview product specification rev. 0.1 page 8 2.2 pin configuration pin assignment top view pin functions no pin name gpio no pin type description a1 gnd ground pin connect to ground a2 nc nc not connected, leave open a3 reset digital input reset, active low a4 vcc power analog/digital power supply connection a5 vcc power analog/digital power supply connection a6 vcc power analog/digital power supply connection a7 gnd ground pin connect to ground a8 nc nc not connected a9 gnd ground pin connect to ground a11 gnd ground pin connect to ground a12 gnd ground pin connect to ground f 2 f 3 f 4 f 5 e 1 e 2 e 3 e 4 e 5 e 6 e 7 e 8 e 9 d 1 d 2 d 3 d 4 d 5 d 6 d 7 d 8 c 1 c 2 c 3 c 4 c 5 c 6 c 7 c 8 b 1 b 2 b 3 b 4 b 5 b 6 b 7 b 8 b 9 a 2 a 3 a 4 a 5 a 6 a 7 a 8 a 1 1 . 0 8 . 7 0 m m 0 . 6 5 . 0 0 . 6 1 . 3 5 1 . 3 5 1 . 2 f 9 1 . 2 f 7 f 1 f 8 d 9 c 9 a 9 1 5 . 6 m m f 6 f 1 1 a 1 1 f 1 2 a 1 2 2 . 4
? PAN1026A bluetooth module 2 overview product specification rev. 0.1 page 9 no pin name gpio no pin type description b1 nc nc not connected, leave open b2 bts gpio 11 b3 bta gpio 10 b4 nc nc not connected, leave open b5 nc nc not connected, leave open b6 nc nc not connected, leave open b7 nc nc not connected, leave open b8 nc nc not connected, leave open b9 nc nc not connected, leave open c1 cs0x gpio 17 c2 bti gpio 13 c3 wia gpio 12 c4 nc nc not connected, leave open c5 nc nc not connected, leave open c6 pcmclk gpio 04 digital i/o pcm clock c7 fsync gpio 05 digital i/o pcm synchronization c8 gnd ground pin connect to ground c9 gnd ground pin connect to ground d1 cs1x gpio 18 d2 din gpio 16 d3 gpio1 gpio 01 digital i/o d4 gpio0 digital i/o d5 nc nc not connected, leave open d6 pcmin gpio 03 digital input pcm in: not supported d7 gnd ground pin connect to ground d8 gnd ground pin connect to ground d9 ant rf - signal antenna pin (not connected for standard version) e1 sda gpio 15 digital i/o i2c interface (only internal) , connect to test pin e2 scl gpio 14 digital i/o i2c interface (only internal) , connect to test pin e3 gnd ground pin connect to ground e4 usb usb direct is not supported by the ic. leave this pin open. e5 clkreq digital output active high once crystal frequency is stable e6 uart rxd digital input uart rxd
? PAN1026A bluetooth module 2 overview product specification rev. 0.1 page 10 no pin name gpio no pin type description e7 pcmout gpio 02 digital output pcm output : n ot supported e8 gnd ground pin connect to ground e9 gnd ground pin connect to ground f1 gnd ground pin connect to ground f2 eeprom_wp digital input internal eeprom write protect ( active high ) f3 gnd ground pin connect to ground f4 gnd ground pin connect to ground f5 uart cts digital input uart cts f6 sleepclk digital input input clock for 32.768 khz f7 uarttxd digital output uart tx f8 uartrts digital output uart rts f9 gnd ground pin connect to ground f11 gnd ground pin connect to ground f12 gnd ground pin connect to ground 2.3 uart interface ? full - duplex 4 - wire data transfer: rx, tx, rts, cts ? programmable baud rate: 2 400 bps to 4.33 mbps ? default baud rate: 115 200 bps ? data format: 8n1, lsb first ? error detection: character timeout, overrun error, framing erro r 2.4 bluetooth features ? bluetooth 4.0 with spp & gatt ? gap support for spp ? gatt s erver and c lient m ode supported for le ? class 2 tx power w/o external pa (improved link robustness ) ? excellent link budget (up to 91 db), enabling long - range applications ? gap peripheral support for le
? PAN1026A bluetooth module 3 detailed descriptio n product specification rev. 0.1 page 11 3 detailed description 3.1 dimensions all dimensions are in millimeters. no. item dimension tolerance remark 1 width 8.70 0.20 2 length 15.60 0.20 3 height 1.80 0.20 with case
? PAN1026A bluetooth module 3 detailed description product specification rev. 0.1 page 12 3.2 footprint the outer dimensions have a tolerance of ? 0.3 mm. top view f 2 f 3 f 4 f 5 e 1 e 2 e 3 e 4 e 5 e 6 e 7 e 8 e 9 d 1 d 2 d 3 d 4 d 5 d 6 d 7 d 8 c 1 c 2 c 3 c 4 c 5 c 6 c 7 c 8 b 1 b 2 b 3 b 4 b 5 b 6 b 7 b 8 b 9 a 2 a 3 a 4 a 5 a 6 a 7 a 8 a 1 1 . 0 8 . 7 0 m m 0 . 6 5 . 0 0 . 6 1 . 3 5 1 . 3 5 1 . 2 f 9 1 . 2 f 7 f 1 f 8 d 9 c 9 a 9 1 5 . 6 m m f 6 f 1 1 a 1 1 f 1 2 a 1 2 2 . 4
? PAN1026A bluetooth module 3 detailed description product specification rev. 0.1 page 13 3.3 packaging the product is a mass production status product and will be delivered in the package described below. 3.3.1 tape dimensions 3.3.2 packing in tape empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. the top cover tape shall not be found on reel holes and it shall not stick out from the reel. 1 0 0 7 3 0 - p a n 1 7 2 0 . v s d t r a i l e r ( e m p t y ) 1 x c i r c u m f e r e n c e / h u b ( m i n 1 6 0 m m ) c o m p o n e n t p a c k e d a r e a s t a n d a r d 1 5 0 0 p c s l e a d e r ( e m p t y ) m i n i m u m 1 0 p i t c h t o p c o v e r t a p e m o r e t h a n 1 x c i r c u m f e r e n c e p l u s 1 0 0 m m t o a v o i d f i x i n g o f t a p e e n d o n s e a l e d m o d u l e s . d i r e c t i o n o f u n r e e l i n g ( f o r c u s t o m e r )
? PAN1026A bluetooth module 3 detailed description product specification rev. 0.1 page 14 3.3.3 component direction 3.3.4 reel dimension
? PAN1026A bluetooth module 3 detailed description product specification rev. 0.1 page 15 3.3.5 package label example (1t) (1p) (2p) (9d) (q) (hw/sw) lot code customer order number, if applicable order number date code quantity hardware/software version 3.3.6 total package
? PAN1026A bluetooth module 3 detailed description product specification rev. 0.1 page 16 3.4 case marking example 1 2 3 4 5 6 7 8 9 mic id brand name hardware/software version order number fcc id lot code engineering sample marking, if applicable marking for pin 1 2d barcode, for internal usage only
? PAN1026A bluetooth module 4 specif ication product specification rev. 0.1 page 17 4 specification all specifications are over temperature and process, unless indicated otherwise. 4.1 default test conditions temperature: 25 10 c humidity: 40 to 85 % rh supply voltage: 3.3 v 4.2 absolute maximum ratings the maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. symbol parameter conditio n min. typ. max. units t stor storage temperature - 40 +125 c v esd esd robustness all pads, according to human body model (hbm), jedec std 22, method a114 1 000 v according to charged device model (cdm), jedec std 22, method c101 500 v p rf rf input level +10 dbm v dig voltage on any digital pins - 0.3 vdd + 0.3 v
? PAN1026A bluetooth module 4 specification product specification rev. 0.1 page 18 4.3 recommended operating conditions the maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. symbol parameter condition min. typ. max. units t a ambient operating temperature range - 40 +85 c v dd 3v3 supply voltage 2.7 3.3 3.6 v 4.4 current consumption the current consumption depends on the user scenario and on the setup and timing in the power modes. assume v dd = 3.3 v, t amb = 25 c, if nothing else stated. parameter condition min. typ. max. units idle current after reset was pulled down. 7.8 ma connected peak power sending dh5 packets. max. output power. 62 ma connected peak power sending dh3 packets. max. output power. 61 ma connected peak power sending dh1 packets. max. output power. 55 ma sleep mode activated sniff mode/not connected/ble advertising 2 ma
? PAN1026A bluetooth module 4 specification product specification rev. 0.1 page 19 4.5 bluetooth parameter condition min. typ. max. units operation frequency range 2 402 2 480 mhz channel spacing bt - classic/ble 1/2 mhz output power maximum setting, measured at dual ended 50 ohm. 4 dbm sensitivity - 88 dbm symbol parameter condition min. typ. max. units 1 spurious emissions conducted measurement with a 50 dual - ended load. complies with en 300 328, en 300 440 class 2, fcc cfr47, part 15 and arib std - t - 66. < - 30 dbm 4.6 reliability tests the measurement should be done after the test device has been exposed to room temperature and humidity for one hour. no. item limit condition 1 vibration test electrical parameter should be in specification ? freq .: 10~50 hz; amplitude: 1.5 mm; 20 min./cycle, 1 hrs. each of xyz axis ? freq.: 30~100 hz, 6g; 20 min./cycle, 1 hrs. each of xyz axis 2 shock test s ee above dropped onto hard wood from a height of 50 cm for 3 times 3 heat cycle test s ee above - 40 c for 30 min. and +85 c for 30 min.; each temperature 300 cycles 4 moisture test s ee above +60 c, 90 % rh, 300 h 5 low temp erature test s ee above - 40 c, 300 h 6 high temp. test s ee above +85 c, 300 h
? PAN1026A bluetooth module 4 specification product specification rev. 0.1 page 20 4.7 recommended s oldering profile ? reflow permissible cycle: 2 ? opposite side reflow is prohibited due to module weight ? more than 75 percent of the soldering area shall be coated by solder ? the soldering profiles should be adhered to in order to prevent electrical or mechanical damage ? soldering profile assumes lead - free soldering
? PAN1026A bluetooth module 5 cautions product specification rev. 0.1 page 21 5 cautions failure to follow the guidelines set forth in this document may result in degrading of the products functions and damage to the product. 5.1 design notes 1. follow the conditions written in this specification, especially the control signals of this module. 2. the supply voltage must be free of ac ripple voltage (for example from a battery or a low nois e regulator output). for noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 f directly at the module). 3. this product should not be mechanically stressed when insta lled. 4. keep this product away from heat. heat is the major cause of decreasing the life of these products. 5. avoid assembly and use of the target equipment in conditions where the products temperature may exceed the maximum tolerance. 6. the supply voltage shou ld not be exceedingly high or reversed. it should not carry noise and/or spikes. 7. keep this product away from other high frequency circuits. 8. refer to the recommended pattern when designing a board. 5.2 installation notes 1. reflow soldering is possible twice base d on the conditions set forth in ? 4.7 recommended s oldering profile . set up the temperature at the soldering portion of this p roduct according to this reflow profile. 2. carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 3. carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 4. if a vinyl - covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. never allow contact between the cover and these products to occur. 5. this product should not be mechanically stressed or vibrated when reflowed. 6. to repair the board by hand soldering, follow the conditions set forth in this chapter. 7. do not wash this product. 8. pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit.
? PAN1026A bluetooth module 5 cautions product specification rev. 0.1 page 22 5.3 usage condition notes 1. take measures to protect the unit against static electricity. if pulses or other transient loads (a large load applied in a short time) are applied to the products, che ck and evaluate their operation befor assembly on the final products. 2. do not use dropped products. 3. do not touch, damage or soil the pins. 4. follow the recommended condition ratings about the power supply applied to this product. 5. electrode peeling strength: do not add pressure of more than 4.9 n when soldered on pcb. 6. pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. these products are intended for general purpose and standard use in general electronic equipment, s uch as home appliances, office equipment, information, and communication equipment. 5.4 storage notes 1. the module should not be stressed mechanically during storage. 2. do not store these products in the following conditions or the performance characteristics of the product, such as rf performance will be adversely affected: C storage in salty air or in an environment with a high concentration of corrosive gas, such as cl2, h2s, nh3, so2, or nox , C storage in direct sunlight , C storage in an environment where the temper ature may be outside the range of 5 c to 35 c, or where the humidity may be outside the 45 to 85 percent range , C storage of the products for more than one year after the date of delivery storage period: please check the adhesive strength of the embossed t ape and soldering after 6 months of storage. 3. keep this product away from water, poisonous gas, and corrosive gas. 4. this product should not be stressed or shocked when transported. 5. follow the specification when stacking packed crates (max. 10). 5.5 safety cautions these specifications are intended to preserve the quality assurance of products and individual components. before use, check and evaluate the operation when mounted on your products. abide by these specifications without deviation when using the p roducts. these products may short - circuit. if electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum:
? PAN1026A bluetooth module 5 cautions product specification rev. 0.1 page 23 1. ensure the safety of the whole system by installing a protection circuit and a protection device. 2. ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status. 5.6 other cautions 1. do not use the products for other purpos es than those listed. 2. be sure to provide an appropriate fail - safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the product. 3. this product has been manufactured without any ozone chem ical controlled under the montreal protocol. 4. these products are not intended for uses other than under the special conditions shown below. before using these products under such special conditions, carefully check their performance and reliability under th e said special conditions to determine whether or not they can be used in such a manner: C in liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash. C in direct sunlight, outdoors, or in a dusty environment. C i n an environment where condensation occurs. C in an environment with a high concentration of harmful gas (e. g. salty air, hcl, cl2, so2, h2s, nh3, and nox). 5. if an abnormal voltage is applied due to a problem occurring in other components or circuits, replac e these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 6. when you have any question or uncertainty, contact panasonic. 5.7 life support policy this panasonic industrial devices europe gmbh product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. panasonic c ustomers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify panasonic industrial devices europe gmbh for any damages resulting.
? PAN1026A bluetooth module 6 regulatory and certification information product specification rev. 0.1 page 2 4 6 regulatory and certification information 6.1 rohs a nd reach declaration the latest declaration of environmental compatibility ( restriction of hazardous substances, rohs and registration, evaluation, authorisation, and restriction of chemicals, reach) for supplied products can be found on the panasonic website in the downloads section of the respective product ? 7.2.2 product information . 6.2 further regulatory information to be discussed.
? PAN1026A bluetooth module 7 appendix product specification rev. 0.1 page 25 7 appendix 7.1 ordering information variants and versions order number brand name description moq 1 enw89837a5kf 2 PAN1026A bluetooth bt4.2 b asic data rate and low e nergy module 1 500 1 abbreviation for minimum order quantity (moq). the default moq for mass production is 1 500 pieces, fewer only on customer demand. samples for evaluation can be delivered at any quantity via the distribution channels. 2 samples are available on customer de mand .
? PAN1026A bluetooth module 7 appendix product specification rev. 0.1 page 26 7.2 contact details 7.2.1 contact us please contact your local panasonic sales office for details on additional product options and services: for panasonic sales assistance in the eu , visit https://eu.industrial.panasonic.com/about - us/conta ct - us email: wireless@eu.panasonic.com for panasonic sales assistance in north america , visit the panasonic sales & support tool to find assistance near you at https://na.industrial.panasonic.com/distributors please visit the panasonic wireless technical forum to submit a question at https://forum.na.industrial.panasonic.com 7.2.2 product information please refer to the panasonic wireless connectivity website for further information on our products and related documents: for complete panasonic product details in the eu , visit http://pideu.panasonic.de/products/wireless - modules.html for complete panasonic product details in north america , visit http://www.panasonic.com/rfmodules

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